The Model 6034 measures wafer Thickness, Total Thickness Variation (TTV), Flatness, Bow and Warp. This system incorporates a similar capacitive measurement technique as the 6033T and is typically used in quality control and wafer processing areas to measure wafers up to 200mm in diameter. 

MicroSense has a singular focus on precision measurement. Provide customers with state-of-the-art measurement performance products - precision capacitive sensors for high resolution, non-contact position sensing; vibrating sample magnetometers and MOKE systems for magnetic property measurement; and wafer metrology systems for accurately measuring wafer thickness and shape.

KLA / MICROSENSE

6034

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