Automated Wafer Thickness Measurement System
IR interferometry probe technology. Single or dual probes.

Thickness and shape measurement of wafers with backgrinding tape wafer on sawframe, dies on tape, wafer on bumps, SOI, multiple layers, bonded wafers, thickness of Si, plastic, glass, adhesive layers.

Wafer 4" to 12" (100 to 300mm) round or square.

MicroSense has a singular focus on precision measurement. Provide customers with state-of-the-art measurement performance products - precision capacitive sensors for high resolution, non-contact position sensing; vibrating sample magnetometers and MOKE systems for magnetic property measurement; and wafer metrology systems for accurately measuring wafer thickness and shape.

UltraMap-300IR

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