MicroSense PV-6060 Non-Contact Photovoltaic Wafer Thickness, TTV and Resistivity Measurement Module.
5 mm diameter sensors are used for thickness measurement, providing high spatial resolution and measurement close to wafer edge.

MicroSense has a singular focus on precision measurement. Provide customers with state-of-the-art measurement performance products - precision capacitive sensors for high resolution, non-contact position sensing; vibrating sample magnetometers and MOKE systems for magnetic property measurement; and wafer metrology systems for accurately measuring wafer thickness and shape.

PV-6060

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