Semiconductors control a host of functions in electronic equipment. Nikon offers a stellar lineup of cutting-edge lithography systems that support precision circuit design down to the nanometer level.

AMI-3000 automatic macro inspection system.

NIKON

AMI-3000

AMI-3500 automatic macro inspection system.

AMI-3500

A ground-breaking multifunctional video measuring system developed on the strength of Nikon’s leading optomechatronics technology. Incorporates confocal technology, brightfield with a 15X zoom, and Laser AF. No matter what geometrical measurements are needed, two-dimensional or three-dimensional, inspection and evaluation is exceptionally fast and accurate.

NEXIV VMZ-K6555

NRM-3100

Nikon’s XT V range comprises world-class X-ray and CT systems for non-destructive inspection of electronic components (PCBs, BGAs, chips and much more).


XT V 130

Suitable for small components used for various kinds of products such as mechanical, electric, electronic, automotive, medical devices, etc.

NEXIV VMZ-R3020

Electronics X-ray Inspection
Specifically designed for use in production lines and failure analysis laboratories, the XT V 160 can be configured with a choice of premium system components to optimize the performance for your needs. Besides manual real-time inspection, the inspection process can be fully automated to maximize productivity.

XT V 160

AMI-3300

Full support for 130nm lithography, plus automatic measurement of NSR Focus Marks.

NRM-1000A

250 mm(X) × 200 mm(Y) × 200 mm(Z) – Standard stroke
A space-saving, low-cost model suited to measure small samples, such as electronic and die cast parts.

iNEXIV VMA-2520

Nikon's V-12B benchtop optical profile projectors offer superb image quality and precise X-Y measurement (optionally angular measurement) capabilities. The image of the sample is displayed on a 12” (305mm) screen, enabling accurate data capture from the stage.

V-12B

Nikon's 6D autocollimator checks alignment and measures very small angular deviations to measure flatness or height by simple geometry. The 6D darkfield model projects a bright crossline and is the most popular model because the bright-line cross is the easiest to see. Provides measuring accuracy down to 0.5 arc seconds.

The standard model of the NEXIV series. It handles a variety of measurement tasks including those for mechanical parts, molded parts, stamped parts and various other workpieces. Electric parts. Semiconductor packages. Substrates. Stamped parts. Connectors. Injection molded parts. Variety of illumination choices facilitate accurate detection of edges in molded parts. Long working distance (50mm) permits measurements of parts with big height gaps. 15X zoom provides universal applications while facilitating easy search at low magnifications and accurate measurements at high magnifications. User-friendly software. Laser AF facilitates evaluations of cross-sectional shapes and 3D profiling as well as the flatness of workpiece surfaces.

NEXIV VMR-3020

300 x 200 x 250 mm *Type TZ with low magnification lens: 250 x 200 x 200 mm.

NEXIV VMZ-S3020

The iNEXIV VMA series CNC video measuring system offers the ultimate in usability for automatic measuring of various 3D components with a large FOV, long working distance and wide XYZ stroke. Suitable for large samples (450 x 400 x 200 mm or larger) and simultaneous measurement of multiple parts. High cost-performance with the same strong cast-iron body and direct bearing as the high end models.

iNEXIV VMA-6555

High-speed measurements with a large stroke stage. Optimal for measurements of PCB patterns and external dimensions of a display panel.

NEXIV VMR-6555

Master instrument in a laboratory.
Dies and molds.
Finely machined parts.
Ultrahigh precision appropriate for the master instrument.
Wide illumination choices ensure accurate detection of edges in dies and molds.
Long working distance (50mm) permits measurements of parts with big height gaps.
15X zoom provides universal applications while facilitating easy search at low magnifications and accurate measurements at high magnifications.
User-friendly software.

NEXIV VMR-H3030

AMI-3000 MARKⅡ automatic macro inspection system.

AMI-3000 MARKⅡ

AMI-5600 automatic macro inspection system.

AMI-5600

Magnification, AF and illumination conditions can be finely adjusted for each sample. Suitable for small components used for products such as mechanical, electric/electronic, automotive, and medical devices.


NEXIV VMZ-S4540

AMI-5700 automatic macro inspection system.

AMI-5700

High precision frontside and backside overlay metrology capabilities for MEMS and leading-edge power devices.

BSM-200

Suitable for large size components and/or "step-and-repeat" measurements of multiple pieces on the stage. Large PCB’s, large plastic molded parts, etc. High density large PCB’s, etc. Large stamped sheet metal parts, Large plastic molded parts, etc.

NEXIV VMZ-R6555

NEXIV VMZ-K3040

NRM-1000A/3000 overlay measurement system.

NRM-3000

Long 1000 x 800 mm stage stroke provides maximum performance in the measurement of large-size workpieces such as FPD devices. 
Printing masks for substrates.
Mother substrates for PCBs.
Shadow masks.
FPD devices.

Long stage stroke enables measurements of LCD substrates/modules and large-size PCBs.
Laser AF also enables measurements of height gaps and warping in workpieces.
Search function enables measurements of lands and holes of PCBs.
Variety of illumination choices facilitate accurate edge detection even for vague geometries.
High-speed stage and high-speed image processing provide high throughput.

NEXIV VMR-10080

Non-contact, fully automatic measurement provides outstanding throughput. Perfect for measuring FOUP and FOSB.
Four side planes of the carrier are continuously measured by rotating the kinematic plate in 90° increments.
SEMI-compliant kinematic plate provides perfect XYZ coordinates.
Variety of illumination choices facilitate accurate measurements of registration pin holes and latch-key holes.
Laser AF provides fast, non-contact measurements of wafer positions.
Wide area, high-intensity LED illumination enables accurate measurements of wafer heights.
300mm, 200mm wafer carrier and SMIF Pod base.

NEXIV VMR-C4540

Suitable for mid-size samples, such as molded and pressed parts. 
450 mm(X) × 400 mm(Y) × 200 mm(Z) – Middle stroke

iNEXIV VMA-4540

A large stroke of 450 x 400 x 200mm allows high-precision, high-speed and easy measuring of various samples.
Newly designed for middle size components and/or series measurements of multiple pieces on the stage. Middle size PCB’s, stamped sheet metal parts, etc. 300mm wafers, 300mm probe cards, etc. Middle size mechanical parts, plastic molded parts, etc.

NEXIV VMZ-R4540

Magnification, AF and illumination conditions can be finely adjusted for each sample. Suitable for small components used for products such as mechanical, electric/electronic, automotive, and medical devices.

NEXIV VMZ-S6555

NRM-1

AMI-2000

The XT V 130C is a highly flexible and cost-effective electronics and semiconductor inspection system. The system features a 130 kV/10 W Nikon Metrology manufactured source, a globally recognized open tube design with integrated generator, and a high-resolution imaging chain.

NIKON

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