The Implant process is a very critical step within the integrated circuits manufacturing line. It defines important characteristics and properties of the devices-to-be by doping certain layers of the silicon substrate.

PVA TEPLA

TWIN

The TWIN SC-3 is a product of PVA TePla America, LLC, a company that focuses on developing systems for vacuum, high-temperature, and plasma processes, as well as quality inspections. This product is used to monitor the implant dosage on wafers up to 300mm in size. The implant process is an essential step in the production of integrated circuits because it determines the characteristics and properties of the devices by doping specific layers of the silicon substrate. The TWIN SC-3 can measure dose levels ranging from 10E10 to 5E16 at implant energy levels from 1keV to 100 MeV.

TWIN SC-3

Wafer Surface Preparation System - Metrology Systems VPD
WSPS system maps the entire VPD process chain in which the processes or modules in a compact system housing fitted with FFU units are supplemented by the corresponding infrastructure.

PVA TEPLA

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トップPVA TEPLA Metrology

WSPS

TWIN SC-3

TWIN

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