説明
説明なし構成
Wafer loading / unloading, Fro 4", 6" and 8" wafer (thickness 150 um or more), Ring frame load / attachment, Capable frame size (DISCO MODT2-8-1 and MODTF2-6-1), Capable frame cassette (DISCO MODT2-8-1 and MODTF2-6-1), Wafer table Levelling Jig, Thrubeam type fiber sensor for tape detection, Attachment accuracy X,Y ; within +/- 0.5 mm, Attachment accuracy theta within +/- 0.5 d, CE Mark and EMC conformity, Signal Tower, ManualOEMモデルの説明
LINTEC RAD-2500 F/8 is a Packaging system. The RAD-2500 F/8 is a 200mm Fully-Automatic Wafer Mounter system. its Max throughput is over 100 wafers per hour.ドキュメント
ドキュメントなし
LINTEC
RAD-2500 F/8
検証済み
カテゴリ
Packaging
主なアイテムの詳細
状態:
Used
稼働ステータス:
不明
製品ID:
20386
ウェーハサイズ:
4"/100mm, 6"/150mm, 8"/200mm
ヴィンテージ:
2012
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示LINTEC
RAD-2500 F/8
検証済み
カテゴリ
Packaging
最終検証: 60日以上前
主なアイテムの詳細
状態:
Used
稼働ステータス:
不明
製品ID:
20386
ウェーハサイズ:
4"/100mm, 6"/150mm, 8"/200mm
ヴィンテージ:
2012
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし構成
Wafer loading / unloading, Fro 4", 6" and 8" wafer (thickness 150 um or more), Ring frame load / attachment, Capable frame size (DISCO MODT2-8-1 and MODTF2-6-1), Capable frame cassette (DISCO MODT2-8-1 and MODTF2-6-1), Wafer table Levelling Jig, Thrubeam type fiber sensor for tape detection, Attachment accuracy X,Y ; within +/- 0.5 mm, Attachment accuracy theta within +/- 0.5 d, CE Mark and EMC conformity, Signal Tower, ManualOEMモデルの説明
LINTEC RAD-2500 F/8 is a Packaging system. The RAD-2500 F/8 is a 200mm Fully-Automatic Wafer Mounter system. its Max throughput is over 100 wafers per hour.ドキュメント
ドキュメントなし