DR 3000III
カテゴリ
Packaging概要（Overview）
Tape Applicator for wafers up to 12". This taping system automates the application of protection tape on the surface of the semiconductor wafer during backgrinding.
現在の掲載品
1
サービス
検査、保証、鑑定、ロジスティクス
Tape Applicator for wafers up to 12". This taping system automates the application of protection tape on the surface of the semiconductor wafer during backgrinding.
1
検査、保証、鑑定、ロジスティクス
