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市場 > Packaging > NITTO > HR 8500 II

HR 8500 II

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Packaging
概要(Overview)

The HR-8500-II is a fully automatic type that can handle wafers up to 8". Equipped with a robot arm for wafer transfer and a CCD type non-contact aligner for wafer alignment, transferring wafers without generating dust. Easy operation is possible with a touch panel. Transfers large diameter wafers without generating dust. An ultraviolet irradiation device can be installed as an option

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