The SIPLACE CA (Chip Assembly) platform can place bare dies directly from wafers, using the die attach or flip chip process. It supports the entire SMT placement capabilities provided by the SIPLACE X Series. The SIPLACE CA can be used for direct die attach or SMD only or in mixed applications to place bare dies along with SMD components in a single pass process.  

Siemens AG (Berlin and Munich) is a global powerhouse in electronics and electrical engineering, operating in the industry, energy and healthcare sectors.

SIPLACE CA

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