説明
説明なし構成
· One Machine with 2 Process Modules and one Square LoadLock in between, · Left Chamber: PECVD (No turbo). · Right Chamber ICP/RIE (with Turbo) and ENDPOINT DETECTOR(LASER),1 Quartz Clamp 6" · LoadLock- Square with rotating arm · PC Computer with Oxford Software Version-PC2000 · All Mechanical Pumps are Oil pump. (3 Pumps) · One Chiller attached to ICP/RIE · 2 Gas Pods: PECVD- SiH4 (silane) N2O NH3 (ammonia) ICP/RIE- C4F8 O2 HeOEMモデルの説明
The Oxford Plasmalab 100 is an inductively coupled plasma (ICP) etcher that is designed for multipurpose use. It is based on fluorocarbon and is capable of anisotropically etching silicon, silicon oxide, and other dielectric materials. The tool is equipped with a temperature-controlled electrode, which allows users to tailor their etch feature profiles. The manual load system can accommodate substrates of various sizes, ranging from 200mm diameter wafers down to small piecesドキュメント
ドキュメントなし
OXFORD
PLASMALAB 100
検証済み
カテゴリ
PECVD
最終検証： 昨日
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
116992
ウェーハサイズ：
不明
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
OXFORD
PLASMALAB 100
カテゴリ
PECVD
最終検証： 昨日
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
116992
ウェーハサイズ：
不明
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし構成
· One Machine with 2 Process Modules and one Square LoadLock in between, · Left Chamber: PECVD (No turbo). · Right Chamber ICP/RIE (with Turbo) and ENDPOINT DETECTOR(LASER),1 Quartz Clamp 6" · LoadLock- Square with rotating arm · PC Computer with Oxford Software Version-PC2000 · All Mechanical Pumps are Oil pump. (3 Pumps) · One Chiller attached to ICP/RIE · 2 Gas Pods: PECVD- SiH4 (silane) N2O NH3 (ammonia) ICP/RIE- C4F8 O2 HeOEMモデルの説明
The Oxford Plasmalab 100 is an inductively coupled plasma (ICP) etcher that is designed for multipurpose use. It is based on fluorocarbon and is capable of anisotropically etching silicon, silicon oxide, and other dielectric materials. The tool is equipped with a temperature-controlled electrode, which allows users to tailor their etch feature profiles. The manual load system can accommodate substrates of various sizes, ranging from 200mm diameter wafers down to small piecesドキュメント
ドキュメントなし