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説明
説明なし構成
PECVD Configured: 200 mm Process: PECVD & TEOS Controller Type: PC Loadlock Loadlock Pump: Alcatel APT 80 Turbo, ACT 200T Controller RF Generator: Advanced Energy LF5 & Advanced Energy RFX 600A Ten Process Gas Inputs with MFCs CF4 80%, O2 20%–500 SCCM—MKS 1179A Ar 90%, PH3 10%–50 SCCM—MKS 1479A Ar 90%, GeH4 10%–50 SCCM—MKS 1479A Ar 90%, BeH6 10%–50 SCCM—MKS 1479A N2 95%, SiH4 5%–1 SLM—MKS 1479A NH3 100%–100 SCCM—MKS 1479A N2O 100%–3 SLM—MKS 1179A N2O 100%–200 SCCM MKS 1179A N2 100%–2 SLM MKS 1179A O2 100%–500 SCCM MKS 1179AOEMモデルの説明
The Oxford Plasmalab 100 is an inductively coupled plasma (ICP) etcher that is designed for multipurpose use. It is based on fluorocarbon and is capable of anisotropically etching silicon, silicon oxide, and other dielectric materials. The tool is equipped with a temperature-controlled electrode, which allows users to tailor their etch feature profiles. The manual load system can accommodate substrates of various sizes, ranging from 200mm diameter wafers down to small piecesドキュメント
ドキュメントなし
カテゴリ
PECVD
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
113537
ウェーハサイズ：
8"/200mm
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
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OXFORD
PLASMALAB 100
カテゴリ
PECVD
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
113537
ウェーハサイズ：
8"/200mm
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし構成
PECVD Configured: 200 mm Process: PECVD & TEOS Controller Type: PC Loadlock Loadlock Pump: Alcatel APT 80 Turbo, ACT 200T Controller RF Generator: Advanced Energy LF5 & Advanced Energy RFX 600A Ten Process Gas Inputs with MFCs CF4 80%, O2 20%–500 SCCM—MKS 1179A Ar 90%, PH3 10%–50 SCCM—MKS 1479A Ar 90%, GeH4 10%–50 SCCM—MKS 1479A Ar 90%, BeH6 10%–50 SCCM—MKS 1479A N2 95%, SiH4 5%–1 SLM—MKS 1479A NH3 100%–100 SCCM—MKS 1479A N2O 100%–3 SLM—MKS 1179A N2O 100%–200 SCCM MKS 1179A N2 100%–2 SLM MKS 1179A O2 100%–500 SCCM MKS 1179AOEMモデルの説明
The Oxford Plasmalab 100 is an inductively coupled plasma (ICP) etcher that is designed for multipurpose use. It is based on fluorocarbon and is capable of anisotropically etching silicon, silicon oxide, and other dielectric materials. The tool is equipped with a temperature-controlled electrode, which allows users to tailor their etch feature profiles. The manual load system can accommodate substrates of various sizes, ranging from 200mm diameter wafers down to small piecesドキュメント
ドキュメントなし