Compatible with Φ12 inch large diameter wafers. 
High precision, low damage grinding (notch / outer circumference).
Compatible with various host communication specifications.

Semiconductor manufacturing equipment: Probing machines, Dicing machines, Precision Blade, Polish grinders, Chemical mechanical planarizers (CMPs), Wafer slicing machines*, Wafer edge grinding machines*
Measuring instruments: Coordinate measuring machines, Surface texture and contour measuring instruments, Roundness and cylindrical profile measuring instruments, Optical measuring instrument, Machine control gauges*, Various types of sensors*



W-GM-5200E

カテゴリ

概要（Overview）

現在の掲載品

サービス

トップ掲載リスト

Moovに掲載品して、すぐに申し分ない購入者を見つけましょう。