説明
Disco DFG841 Back Grinder構成
2 grind tables2 grind tablesOEMモデルの説明
The Disco DFG841 is designed for device manufacturers and can handle wafers with a maximum diameter of 200mm (ø4"ø8"). It uses a two-wheel grinding process (rough and fine grinding) for low TTV applications. It features a two-spindle, two-chuck table configuration and an advanced vacuum robot arm for thin wafer handling. The robot arm vacuum corrects thin-ground wafers to the required flatness for trouble-free handling. All wafer transportation is conducted in a safe and secure environment. The machine is designed for ease of maintenance and has a lightweight construction.ドキュメント
ドキュメントなし
DISCO
DFG841
検証済み
カテゴリ
Polishing and Grinding
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
93124
ウェーハサイズ：
不明
ヴィンテージ：
1997
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
DISCO
DFG841
検証済み
カテゴリ
Polishing and Grinding
最終検証： 28日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
93124
ウェーハサイズ：
不明
ヴィンテージ：
1997
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Disco DFG841 Back Grinder構成
2 grind tables2 grind tablesOEMモデルの説明
The Disco DFG841 is designed for device manufacturers and can handle wafers with a maximum diameter of 200mm (ø4"ø8"). It uses a two-wheel grinding process (rough and fine grinding) for low TTV applications. It features a two-spindle, two-chuck table configuration and an advanced vacuum robot arm for thin wafer handling. The robot arm vacuum corrects thin-ground wafers to the required flatness for trouble-free handling. All wafer transportation is conducted in a safe and secure environment. The machine is designed for ease of maintenance and has a lightweight construction.ドキュメント
ドキュメントなし