説明
説明なし構成
Equipped with the following chuck type and options: ATT B300T (for FP3000 vacuum-base / ambient chuck type) -For 8” & 12” -Nicle coating (matt) -Plain multi-hole vacuum layout -Max. 500V (standard) -NO temperature control (ambient only) Additional Notes - This is a “special chuck design” with 3 additional temperature sensors that are routed to the outside (to the measuring device) - not a standard - The chuck currently has no controller and can therefore only be operated “ambient” (i.e. without temperature control).OEMモデルの説明
The FP3000 is a probing machine manufactured by ACCRETECH. It is a 300mm framed wafer & CSP handling machine that performs precision measurement using their unique correction technology on cut wafer, package and such that are attached to the dicing frame. It is a multi-functional prober that performs transfer and testing on a frame as well as wafer with only one click of button by optional function.ドキュメント
ドキュメントなし
カテゴリ
Probers
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
124105
ウェーハサイズ：
不明
ヴィンテージ：
2016
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ACCRETECH / TSK
FP3000
カテゴリ
Probers
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
124105
ウェーハサイズ：
不明
ヴィンテージ：
2016
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし構成
Equipped with the following chuck type and options: ATT B300T (for FP3000 vacuum-base / ambient chuck type) -For 8” & 12” -Nicle coating (matt) -Plain multi-hole vacuum layout -Max. 500V (standard) -NO temperature control (ambient only) Additional Notes - This is a “special chuck design” with 3 additional temperature sensors that are routed to the outside (to the measuring device) - not a standard - The chuck currently has no controller and can therefore only be operated “ambient” (i.e. without temperature control).OEMモデルの説明
The FP3000 is a probing machine manufactured by ACCRETECH. It is a 300mm framed wafer & CSP handling machine that performs precision measurement using their unique correction technology on cut wafer, package and such that are attached to the dicing frame. It is a multi-functional prober that performs transfer and testing on a frame as well as wafer with only one click of button by optional function.ドキュメント
ドキュメントなし