LEDA P6801

LEDA-3GP

TS200

150 mm Manual Probe System for accurate and reliable DC/CV and RF measurements.



TS150

TS3000

High-performance solution for on-wafer applications, offering RF measurements up to 67 GHz and broadband integration up to 220 GHz. Ideal for RF, DC, and high-power testing (up to 10 kV/400 A), it ensures 24/7 production reliability with safety interlocks. Ergonomically designed for seamless wafer handling, supporting up to 200 mm wafers and advanced optics for precise alignment. Compatible with thermal chucks (20–300 °C) and thin wafer handling down to 50 µm. Experience unparalleled accuracy and efficiency in semiconductor testing.

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LEDA P6801

LEDA-3GP

VEGA TP60-W1

TS200

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