Feature:
Application for wafer size : 8”~12”
Contact accuracy : ±1㎛ (Advanced motion control technology)
Improvement of loading accuracy (Wafer change and align time reduction)
Stiffness Z-axis (250 kgf)
Application of auto leveling / securing the stability of contact (10㎛)
Auto card change (Side auto card change)

Semes have achieved growth centering on cleaning, etching, and photo-track equipment used in the semiconductor manufacturing process. Also, the advancement has been shown in such sectors as test & package, semiconductor logistics automation equipment, and display OLED.

IP-300H

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