Feature:
Application for wafer size : 8”~12”
Contact accuracy: ±1㎛ (Advanced motion control technology)
Improvement of Loading Accuracy (Wafer change and align time reduction)
Stiffness Z-axis (1,000 kgf)
Precision temperature control (4℃@2,000W)
Application of auto leveling / securing the stability of contact (10㎛)
Self-diagnosis system (Life prediction, Pre-detection)
Auto card change (Side/front auto card change)
Advanced wafer & card automation (RGV, OHT, AGV)

Semes have achieved growth centering on cleaning, etching, and photo-track equipment used in the semiconductor manufacturing process. Also, the advancement has been shown in such sectors as test & package, semiconductor logistics automation equipment, and display OLED.

SEMPRO PRIME

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概要（Overview）

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