説明
説明なし構成
Model Precio CPU Main CPU Comm I/F GPIB SACC n/a Inker n/a Polisher n/a Chuck Type Hot (hot chuck but no temp controller) Temp.Ambient Chuck Ni OCR n/a Loader type TS1 Buffer Table Front Option - 1 USB no manipulators fully operational and onlineOEMモデルの説明
The Precio™ series is a fully automatic wafer-probing platform designed to meet the increasing demand for probing technology in the test process. With process miniaturization, higher device functionality, and package variety, the Precio™ series offers reliable solutions to a wide range of probing demands. It has a wafer size of 200/300mm and uses ball screw stage technology. The XY probing accuracy is ±1.8μm, and the Z probing accuracy is ±5.0μm, allowing for more reliable contacts and greater Z-axis control for soft contact. The probing force is 200/300kg (available as an option). The optical system used is ASU/BCU-Ⅱ, and the operation system is Windows+VME. Optimum temperature control during testing and increased parallel die testing are also achieved with the Precio™ prober series.ドキュメント
ドキュメントなし
TEL / TOKYO ELECTRON
PRECIO
検証済み
カテゴリ
Probers
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
18342
ウェーハサイズ：
不明
ヴィンテージ：
2008
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
TEL / TOKYO ELECTRON
PRECIO
検証済み
カテゴリ
Probers
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
18342
ウェーハサイズ：
不明
ヴィンテージ：
2008
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし構成
Model Precio CPU Main CPU Comm I/F GPIB SACC n/a Inker n/a Polisher n/a Chuck Type Hot (hot chuck but no temp controller) Temp.Ambient Chuck Ni OCR n/a Loader type TS1 Buffer Table Front Option - 1 USB no manipulators fully operational and onlineOEMモデルの説明
The Precio™ series is a fully automatic wafer-probing platform designed to meet the increasing demand for probing technology in the test process. With process miniaturization, higher device functionality, and package variety, the Precio™ series offers reliable solutions to a wide range of probing demands. It has a wafer size of 200/300mm and uses ball screw stage technology. The XY probing accuracy is ±1.8μm, and the Z probing accuracy is ±5.0μm, allowing for more reliable contacts and greater Z-axis control for soft contact. The probing force is 200/300kg (available as an option). The optical system used is ASU/BCU-Ⅱ, and the operation system is Windows+VME. Optimum temperature control during testing and increased parallel die testing are also achieved with the Precio™ prober series.ドキュメント
ドキュメントなし