概要（Overview）

System configuration: Cluster type (up to three process chambers) C to C type Substrate size: φ200mm maximum Cathode: φ7.1" cathode (Up to 4. Varies depending on the module.) Modules: Offset rotary sputtering module (multi-cathode specification) Offset rotary and revolutionary sputtering module Etching module (preprocessing) Preheating module (preprocessing)