説明
説明なし構成
-Software Version 5.65B38_1.80B27 -CIM E84, SECS/GEM, GEM300, INTERFACE A -Process TFM_TiN-HM Dep -Main System Novellus_TiNMetalDepOEMモデルの説明
The INOVA NExT, a 300mm metallization system designed to deposit highly conformal copper barrier-seed films at 45 nanometers and beyond. On the INOVA NExT, the single target HCM technology has been extended to the 45 nanometer node; the system also features an integrated ion-induced atomic layer deposition (iALD) module to deposit tantalum nitride (TaN) barrier films below 45 nanometers.ドキュメント
ドキュメントなし
LAM RESEARCH / NOVELLUS
INOVA NExT
検証済み
カテゴリ
PVD / Sputtering
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
106057
ウェーハサイズ：
12"/300mm
ヴィンテージ：
2013
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
LAM RESEARCH / NOVELLUS
INOVA NExT
カテゴリ
PVD / Sputtering
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
106057
ウェーハサイズ：
12"/300mm
ヴィンテージ：
2013
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし構成
-Software Version 5.65B38_1.80B27 -CIM E84, SECS/GEM, GEM300, INTERFACE A -Process TFM_TiN-HM Dep -Main System Novellus_TiNMetalDepOEMモデルの説明
The INOVA NExT, a 300mm metallization system designed to deposit highly conformal copper barrier-seed films at 45 nanometers and beyond. On the INOVA NExT, the single target HCM technology has been extended to the 45 nanometer node; the system also features an integrated ion-induced atomic layer deposition (iALD) module to deposit tantalum nitride (TaN) barrier films below 45 nanometers.ドキュメント
ドキュメントなし