説明
There are some missing parts that cannot be used normally. Missing Parts: PM1: MMC qty 1 PM2: MMC qty 1 PM1: Ring Tilt Mechanism Lift Unit qty 1 PM2: Ring Tilt Mechanism Lift Unit qty 1構成
Rapid Thermal Processing Device After verifying with on-site personnel, it was confirmed that "the quartz inside the chamber is still intact and usable during the shutdownOEMモデルの説明
Helios family RTP systems offer unique double-side heating RTP technology. It can achieve the highest wafer temperature ramp rate while balancing wafer frontside and backside temperatures, eliminate pattern-loading effect, provide unique wafer stress management capabilities, satisfy technical requirements for RTP processes with different substrate thickness and device structures, and achieve the highest system productivity at the same time.ドキュメント
ドキュメントなし
MATTSON
HELIOS
検証済み
カテゴリ
RTP/RTA
最終検証： 12日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
75593
ウェーハサイズ：
12"/300mm
ヴィンテージ：
2008
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
MATTSON
HELIOS
カテゴリ
RTP/RTA
最終検証： 12日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
75593
ウェーハサイズ：
12"/300mm
ヴィンテージ：
2008
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
There are some missing parts that cannot be used normally. Missing Parts: PM1: MMC qty 1 PM2: MMC qty 1 PM1: Ring Tilt Mechanism Lift Unit qty 1 PM2: Ring Tilt Mechanism Lift Unit qty 1構成
Rapid Thermal Processing Device After verifying with on-site personnel, it was confirmed that "the quartz inside the chamber is still intact and usable during the shutdownOEMモデルの説明
Helios family RTP systems offer unique double-side heating RTP technology. It can achieve the highest wafer temperature ramp rate while balancing wafer frontside and backside temperatures, eliminate pattern-loading effect, provide unique wafer stress management capabilities, satisfy technical requirements for RTP processes with different substrate thickness and device structures, and achieve the highest system productivity at the same time.ドキュメント
ドキュメントなし