概要（Overview）

Two high-speed (max. 60,000rpm), ultralow-vibration air spindles are provided. DISCO’s original blade know-how and ultralow-vibration, high-speed spindles work together to achieve high-quality dicing at high speed, for not only silicon wafers but also compound semiconductor wafers. The dual spindle configuration ensures improved throughput via dual dicing and enhanced quality via step and bevel cutting.