説明
The laser head is new. System is working condition.構成
Laser type： Laser grooving for Si Laser head： FX Laser path： BSS6OEMモデルの説明
The DFL7161 is a fully automatic laser saw for Φ300 mm wafers. It has a maximum processing range of 310 mm on both the X and Y axes and can move at speeds between 1 and 1,000 mm/s on the X-axis. The Z-axis has a moving resolution of 0.000015 mm and a repeatability accuracy of 0.002 mm. The θ-axis (Chuck table) has a maximum rotating angle of 330 degrees (standard) or 380 degrees (option). The equipment dimensions are 1,560 × 1,550 × 1,800 mm (W×D×H) and it weighs approximately 2,300 kg.ドキュメント
ドキュメントなし
DISCO
DFL7161
検証済み
カテゴリ
Scribing, Cutting, Dicing
最終検証： 20日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
115179
ウェーハサイズ：
不明
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
DISCO
DFL7161
カテゴリ
Scribing, Cutting, Dicing
最終検証： 20日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
115179
ウェーハサイズ：
不明
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
The laser head is new. System is working condition.構成
Laser type： Laser grooving for Si Laser head： FX Laser path： BSS6OEMモデルの説明
The DFL7161 is a fully automatic laser saw for Φ300 mm wafers. It has a maximum processing range of 310 mm on both the X and Y axes and can move at speeds between 1 and 1,000 mm/s on the X-axis. The Z-axis has a moving resolution of 0.000015 mm and a repeatability accuracy of 0.002 mm. The θ-axis (Chuck table) has a maximum rotating angle of 330 degrees (standard) or 380 degrees (option). The equipment dimensions are 1,560 × 1,550 × 1,800 mm (W×D×H) and it weighs approximately 2,300 kg.ドキュメント
ドキュメントなし