N-TEC

BW300FA

BW330FA

Full Auto Wafer Breaker

Feature:
-SECS / GEM functions
-Breaks 12″ wafer attached to 12″ frame
-OCR Wafer ID identification
-Capable of working on wafers with metal balls on surface
-Breaks 8″/ 12″ wafers by switching with software, without the need to change conversion kit
-Image acquisition from front or back of the wafer can be set by recipe depending on product requirements
-Special cushioned platform structure to improve product breaking yields
-Advanced dust collection for instant dry cleaning

3121-1FA

Full Auto IC Wafer Breaker

Feature:
-CCD of detecting full ∕ broken wafer
-Top CCD
-SECS ∕ GEM


N-TEC

概要（Overview）

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トップN-TEC Scribing, Cutting, Dicing

BW300FA

BW330FA

381FA

3121-1FA

Moovに掲載品して、すぐに申し分ない購入者を見つけましょう。

すべてのN-TEC Scribing, Cutting, Dicing