説明
説明なし構成
構成なしOEMモデルの説明
The Helios NanoLab 600 is a Dual Beam FIB/SEM (Focused Ion Beam/Scanning Electron Microscope) that is designed for high-end imaging during failure analysis. It features an extreme high-resolution column, a fine-probe ion source, and a 150 x 150 mm, five-axis, XY piezo stage. This makes it a smart investment for failure-analysis labs that require versatile sample handling, from packaged parts to eight-inch wafers. The Helios NanoLab 600 is particularly useful for cross-sectioning samples and delivers three-dimensional imaging, allowing you to quickly and efficiently locate and view device features from different angles. Additionally, patented beam chemistries can be used to highlight interface layers for imaging in the system, providing you with the most accurate data possible without additional preparation steps outside the system.ドキュメント
ドキュメントなし
THERMOFISHER SCIENTIFIC / FEI / PHILLIPS
HELIOS NANOLAB 600
検証済み
カテゴリ
SEM / FIB
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
84145
ウェーハサイズ：
不明
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
THERMOFISHER SCIENTIFIC / FEI / PHILLIPS
HELIOS NANOLAB 600
カテゴリ
SEM / FIB
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
84145
ウェーハサイズ：
不明
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし構成
構成なしOEMモデルの説明
The Helios NanoLab 600 is a Dual Beam FIB/SEM (Focused Ion Beam/Scanning Electron Microscope) that is designed for high-end imaging during failure analysis. It features an extreme high-resolution column, a fine-probe ion source, and a 150 x 150 mm, five-axis, XY piezo stage. This makes it a smart investment for failure-analysis labs that require versatile sample handling, from packaged parts to eight-inch wafers. The Helios NanoLab 600 is particularly useful for cross-sectioning samples and delivers three-dimensional imaging, allowing you to quickly and efficiently locate and view device features from different angles. Additionally, patented beam chemistries can be used to highlight interface layers for imaging in the system, providing you with the most accurate data possible without additional preparation steps outside the system.ドキュメント
ドキュメントなし