The NVision 40 operates with two beams, one electron beam and one ion beam. Both beams can be used independently of each other to generate images using the secondary electrons emitted from the surface of the specimen. The ion beam can be used for imaging in addition material removal or coating purposes.

ZEISS is the global technology leader in the production of systems and modules for microchip production. With semiconductor manufacturing optics, photomask systems and process control solutions, ZEISS supplies key technologies for the production of ultra-fine conductor track structures on silicon wafers – the raw material used to make microchips. Advances in computer technology largely rely on the ongoing development of optical lithography – every new generation enables even finer structures to be produced on the microchips. This makes circuits more compact, resulting in more powerful and more energy-efficient microchips every year. ZEISS has been driving the development of semiconductor manufacturing technology right from day one. ZEISS’ new and unique extreme ultraviolet (EUV) lithography has created a series of further generations of microchips with ever greater integration density and performance.

NVision 40

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