概要（Overview）

This high performance tool cleans, rinses and dries product as large as 300mm round or 300mm square. With 25 wafers per chamber, this tool is available in single or double-bowl configurations. Introduced in 1979, over 25,000 units have shipped worldwide. The SRD can be configured to benchtop, stand-alone or bulkhead fab requirements. FEATURES Spray - On-axis orientation allows cold or hot (>50ºC) water to evenly spray the wafers Clean/Rinse - Built-in resistivity monitoring assures an automatic and reliable clean: the process chamber is cleaned with the product: quick-ramp, brushless DC motor provides economy and efficiency Dry - Centrifugal drying, coupled with heated, filtered nitrogen and a low-pressure nitrogen purge with blanket heaters Efficient Chamber Design Flexible - Easy to change rotors for simple reconfiguration to match any array of applications Fast - A typical 25-wafer payload takes <7 minutes for a complete cycle (load, rinse, spin dry, unload) Ultra Clean - On-axis orientation keeps wafers parallel, allowing fresh DI water manifolds to spray both sides of the product uniformly Efficient - Up to ten user-defined recipes Low CoO - Smallest footprint with the highest throughput available with over 95% uptime RELATED PROCESSES AND TECHNOLOGIES PROCESSES SUPPORTED Spray Clean (SRD) Spin-Rinse-DrySpray Clean (SRD) Spin-Rinse-Dry