RTP-150-HV - Rapid Thermal Vacuum Process Oven
For wafer size up to 150 mm dia. 
Ramp up rate up to 75 K/sec
SIMATIC® controller with 7“ touch panel
Vacuum up to 10-3 hPa
Process gas line with Mass Flow Controller for Nitrogen 

Specialized in all kinds of thermal process equipment. Unitemp key features are rapid thermal annealing systems, reflow solder ovens (fluxless and void free soldering) and high precision hot plates. They also offer a VSS Vacuum Solder System where flux can be used.

RTP-150-HV

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