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説明
The FLX-2320 is a thin film stress machine. A laser scanner is used to measure the changes in the radius of curvature of the substrate caused by the deposition of a thin film on the wafer. This is accomplished by first measuring the wafer curvature before the film is deposited and then re-measuring the curvature after the film is deposited. A well-known mathematical relation is then used to calculate the stress of the thin film.構成
構成なしOEMモデルの説明
提供なしドキュメント
ドキュメントなし
KLA
FLX 2320A
カテゴリ
Thin Film / Film Thickness
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
115322
ウェーハサイズ：
不明
ヴィンテージ：
1993
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説明
The FLX-2320 is a thin film stress machine. A laser scanner is used to measure the changes in the radius of curvature of the substrate caused by the deposition of a thin film on the wafer. This is accomplished by first measuring the wafer curvature before the film is deposited and then re-measuring the curvature after the film is deposited. A well-known mathematical relation is then used to calculate the stress of the thin film.構成
構成なしOEMモデルの説明
提供なしドキュメント
ドキュメントなし