EV Group (EVG) is a leading supplier of high-volume production equipment and process solutions for the manufacture of semiconductors, MEMS, compound semiconductors, power devices and nanotechnology devices.
A recognized market and technology leader in wafer-level bonding and lithography for advanced packaging and nanotechnology, EVG’s key products include wafer bonding, thin-wafer processing and lithography/nanoimprint lithography (NIL) equipment, photoresist coaters, as well as cleaning and inspection/metrology systems.

EVGroup (EVG)

The fully automated temporary bonding system achieves the whole temporary bonding process – starting with temporary adhesive application, baking, alignment and bonding of the device wafer to the carrier wafer – within one automated tool. The equipment layout is modular as with all of EVG’s fully automated tools, meaning it can be throughput-optimized depending on the specific process. The optional inline metrology module allows total process monitoring and parameter optimization with feedback loops. Because of EVG’s open platform, different types of temporary bonding adhesives can be used, such as spin coat thermoplast, thermoset materials, or tapes.

Wafer Bonder

EVGroup (EVG)

EVG850 TB

Wafer Bonders

同様のリスト

EVGroup (EVG)

EVG850 TB

EVGroup (EVG)

EVG850 TB

EVGroup (EVG)

EVG850 TB

EVG850 TB

Wafer Bonders

同様のリスト

EVGroup (EVG)

EVG850 TB

EVGroup (EVG)

EVG850 TB

EVGroup (EVG)

EVG850 TB