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6" Fab For Sale from Moov - Click Here to Learn More
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6" Fab For Sale from Moov - Click Here to Learn More
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SUSS MicroTec / KARL SUSS SB6 Gen2
    説明
    Temporary Wafer Bonding
    構成
    構成なし
    OEMモデルの説明
    SB6/8 Gen2 SUSS MicroTec provides a semi-automated platform for multiple bonding processes. Handling wafers up to 200mm as well as various shapes and types of substrates the SB6/8 Gen2 presents itself as a flexible tool for various applications and process environments. The SB6/8 Gen2 is suitable for packaging as well structuring meeting the requirements for MEMS, LED, advanced packaging, 2,5D integration, and 3D integration. SB6 Gen2 - from pieces up to 150mm wafers. Wafer Bonder
    ドキュメント

    ドキュメントなし

    SUSS MicroTec / KARL SUSS

    SB6 Gen2

    verified-listing-icon

    検証済み

    カテゴリ
    Wafer Bonders

    最終検証: 30日以上前

    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    不明


    製品ID:

    103668


    ウェーハサイズ:

    不明


    ヴィンテージ:

    2022


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    同様のリスト
    すべて表示
    SUSS MicroTec / KARL SUSS SB6 Gen2

    SUSS MicroTec / KARL SUSS

    SB6 Gen2

    Wafer Bonders
    ヴィンテージ: 2022状態: 中古
    最終確認30日以上前

    SUSS MicroTec / KARL SUSS

    SB6 Gen2

    verified-listing-icon
    検証済み
    カテゴリ
    Wafer Bonders
    最終検証: 30日以上前
    listing-photo-a32f2499f60944e582eabb0da0967bd6-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/3102/a32f2499f60944e582eabb0da0967bd6/b0af8edbd9714af1af18652f29d4c42f_bonding_mw.jpg
    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    不明


    製品ID:

    103668


    ウェーハサイズ:

    不明


    ヴィンテージ:

    2022


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    説明
    Temporary Wafer Bonding
    構成
    構成なし
    OEMモデルの説明
    SB6/8 Gen2 SUSS MicroTec provides a semi-automated platform for multiple bonding processes. Handling wafers up to 200mm as well as various shapes and types of substrates the SB6/8 Gen2 presents itself as a flexible tool for various applications and process environments. The SB6/8 Gen2 is suitable for packaging as well structuring meeting the requirements for MEMS, LED, advanced packaging, 2,5D integration, and 3D integration. SB6 Gen2 - from pieces up to 150mm wafers. Wafer Bonder
    ドキュメント

    ドキュメントなし

    同様のリスト
    すべて表示
    SUSS MicroTec / KARL SUSS SB6 Gen2

    SUSS MicroTec / KARL SUSS

    SB6 Gen2

    Wafer Bondersヴィンテージ: 2022状態: 中古最終検証:30日以上前