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説明
The tool functioned properly when last used in 2019-ish The PC has a “Memory leak” which means that after being powered on for a day or so the PC does not have enough memory to operate and needs to be restarted. All of the tools functions other than that, worked properly and was well maintained Has spare parts構成
Fixturing for 4” 6” capableOEMモデルの説明
The SB8e and the SB6e (SB8e/6e) represent the latest generation technology in substrate bonders offering precision performance and flexibility in a user-friendly, high-quality package. The newly designed and enhanced SB8e/6e are semi-automatic, computer-controlled systems with both vacuum- and pressurecontrolled atmosphere capability featuring an ergonomic load/ unload station. The SB8e/6e delivers superior post bond alignment accuracy resulting from precision mechanics, uniform force capability and leading temperature control. When matched with SUSS’ bond aligners, BA8/6, they offer enabling capability for MEMS, 3-D interconnects, and opto-electronics. This generation’s bond chamber and tooling supports all types of bond processes with optimization especially for thermocompression bonding and the flexibility to switch to anodic bond tooling. The flexibility of these bond systems make them ideal and economical for laboratories and small series production. Yet, combined with SUSS’ patent-pending low temperature plasma activation module these systems offer enabling technology for fusion bonding of SOI, III/V, and SiGe compounds at temperatures down to 200°C. Wafer Bonderドキュメント
ドキュメントなし
カテゴリ
Wafer Bonders
最終検証： 4日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
124433
ウェーハサイズ：
不明
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
SUSS MicroTec / KARL SUSS
SB6e
カテゴリ
Wafer Bonders
最終検証： 4日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
124433
ウェーハサイズ：
不明
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
The tool functioned properly when last used in 2019-ish The PC has a “Memory leak” which means that after being powered on for a day or so the PC does not have enough memory to operate and needs to be restarted. All of the tools functions other than that, worked properly and was well maintained Has spare parts構成
Fixturing for 4” 6” capableOEMモデルの説明
The SB8e and the SB6e (SB8e/6e) represent the latest generation technology in substrate bonders offering precision performance and flexibility in a user-friendly, high-quality package. The newly designed and enhanced SB8e/6e are semi-automatic, computer-controlled systems with both vacuum- and pressurecontrolled atmosphere capability featuring an ergonomic load/ unload station. The SB8e/6e delivers superior post bond alignment accuracy resulting from precision mechanics, uniform force capability and leading temperature control. When matched with SUSS’ bond aligners, BA8/6, they offer enabling capability for MEMS, 3-D interconnects, and opto-electronics. This generation’s bond chamber and tooling supports all types of bond processes with optimization especially for thermocompression bonding and the flexibility to switch to anodic bond tooling. The flexibility of these bond systems make them ideal and economical for laboratories and small series production. Yet, combined with SUSS’ patent-pending low temperature plasma activation module these systems offer enabling technology for fusion bonding of SOI, III/V, and SiGe compounds at temperatures down to 200°C. Wafer Bonderドキュメント
ドキュメントなし