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Wafer Grinding概要（Overview）
This machine is suitable for chamfer and round grinding of squared mono-crystalline silicon work pieces in the format of 125 x 125 mm and 156 x 156 mm, with three grinding aggregates (2x pre-, 1x fine grinding) and one additional grinding aggregate for OD grinding. Work piece lengths of 180 up to 1000 mm can be processed.
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