IG 180 SD
カテゴリ
Wafer Grinding概要（Overview）
-18" variable speed table -10HP variable speed grinding spindle motor -Electromagnetic chuck with auto demag cycle which can be configured with custom workholding systems -Thru-spindle vacuum/pressure feed -Integral air mist collection and coolant flow systems for clean consistent grinding -Programmable touch screen controls -Manual handwheel for precise Z-axis positioning -Internal memory for saving grind process recipes for quick changeovers -Password protection and operator lock-out features -Automatic routine maintenance reminders -82" x 70" footprint
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