DFG8560
カテゴリ
Wafer Grinding概要(Overview)
The Disco DFG8560 is a Fully Automatic In-Feed Surface Grinder that supports advancements for thinner and larger wafers up to Φ300 mm. It is the successor to the DFG800 series and has inherited grinding specifications with an established reputation1. The equipment weight has been reduced by 1.0 t (20% less than DFG860) while maintaining the same basic specifications and performance level as the 800 series.
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