The KOYO KVD-300C is a CNC-controlled vertical double disc grinder designed for high-precision grinding of small to medium-sized parts. It features a 12-inch diameter grinding wheel and can accommodate workpieces up to 4 inches in outer diameter and 2 inches in width. This machine is commonly used in industries such as automotive, aerospace, and appliance manufacturing for tasks like grinding miniature bearing races, oil pump components, and washers.

KOYO

KVD-300C

The KOYO R631DF is a specialized grinding machine designed for processing hard and brittle wafers, such as silicon carbide (SiC) and composite materials. It serves as an alternative to traditional lapping machines, offering high-precision grinding capabilities. The R631DF features fully automated cassette-to-cassette operation, allowing for the storage of grinding parameters for each wafer.

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トップKOYO Wafer Grinding

KVD-300C

R631DF

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すべてのKOYO Wafer Grinding