説明
説明なし構成
AMAT Producer_GT(CVD), Vecco, ASM, VarianOEMモデルの説明
The PRI Automation MagnaTran 8 QuadraFly is an advanced robotic system designed for high-precision wafer handling in a vacuum environment. It features SCARA arm technology and direct drive robotics, allowing the simultaneous exchange of four wafers within a compact swing diameter. The QuadraFly robot's patented tri-axial drive enables it to handle heavier payloads, making it suitable for various applications such as Flip Chip, WLCSP, BDA's, MEMS, GaAS, Laser Bars, and bare silicon. The direct magnetic drive technology enhances reliability by reducing the number of parts and eliminating the need for dynamic seals, leading to fewer failures and improved positional repeatability. This system offers efficient and precise wafer handling with minimized vibration, particle generation, and backlash, making it an ideal choice for semiconductor manufacturing processes.ドキュメント
ドキュメントなし
BROOKS / PRI AUTOMATION
MAGNATRAN 8
検証済み
カテゴリ
Wafer Handling
最終検証： 30日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
115905
ウェーハサイズ：
不明
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
BROOKS / PRI AUTOMATION
MAGNATRAN 8
カテゴリ
Wafer Handling
最終検証： 30日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
115905
ウェーハサイズ：
不明
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし構成
AMAT Producer_GT(CVD), Vecco, ASM, VarianOEMモデルの説明
The PRI Automation MagnaTran 8 QuadraFly is an advanced robotic system designed for high-precision wafer handling in a vacuum environment. It features SCARA arm technology and direct drive robotics, allowing the simultaneous exchange of four wafers within a compact swing diameter. The QuadraFly robot's patented tri-axial drive enables it to handle heavier payloads, making it suitable for various applications such as Flip Chip, WLCSP, BDA's, MEMS, GaAS, Laser Bars, and bare silicon. The direct magnetic drive technology enhances reliability by reducing the number of parts and eliminating the need for dynamic seals, leading to fewer failures and improved positional repeatability. This system offers efficient and precise wafer handling with minimized vibration, particle generation, and backlash, making it an ideal choice for semiconductor manufacturing processes.ドキュメント
ドキュメントなし