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市場 > Wafer Handling > GENMARK > Remote Pre-Aligner

Remote Pre-Aligner

カテゴリ
Wafer Handling
概要(Overview)

The Remote Pre-Aligner (RPA) is an intelligent robot add-on, providing accurate and non-contact measurement of the eccentricity and the orientation of substrate placement. It is designed to be seamlessly integrated with Gencobot series 4, 7, 8, and GPR-SM when substrate alignment is required by the material handling application.

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