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STRASBAUGH 6DS-SP
  • STRASBAUGH 6DS-SP
  • STRASBAUGH 6DS-SP
  • STRASBAUGH 6DS-SP
説明
Multi-Process CMP
構成
構成なし
OEMモデルの説明
6DS-SP CMP system, a game-changer for high-volume production environments that crave efficiency and precision. Armed with two wafer carriers and dual tables, this system effortlessly accommodates wafer sizes ranging from 100mm to 200mm. A standout feature is its sophisticated motor current endpoint, providing real-time feedback for unprecedented accuracy and control. The innovative multi-zoned ViPRR carriers contribute to its superiority, enhancing wafer handling and boosting process consistency. Where this system truly shines is in its performance capabilities. For 200mm Oxide CMP, it boasts an impressive WIW Uniformity of less than 5% 1 sigma, and a minimal edge exclusion of just 3mm, ensuring a meticulous yield. The 6DS-SP is not merely limited to Oxide applications but extends its prowess to W, AITiC, SOI, and PolySi domains, offering unparalleled flexibility. Equip your production line with the 6DS-SP CMP system, where advanced technology meets unmatched versatility.
ドキュメント

ドキュメントなし

verified-listing-icon

検証済み

カテゴリ
Wafer Polishing

最終検証: 30日以上前

主なアイテムの詳細

状態:

Used


稼働ステータス:

不明


製品ID:

56716


ウェーハサイズ:

8"/200mm


ヴィンテージ:

不明


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示

STRASBAUGH

6DS-SP

verified-listing-icon
検証済み
カテゴリ
Wafer Polishing
最終検証: 30日以上前
listing-photo-b6d876eb1e3642edaeda00b0e13aacf9-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
主なアイテムの詳細

状態:

Used


稼働ステータス:

不明


製品ID:

56716


ウェーハサイズ:

8"/200mm


ヴィンテージ:

不明


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Multi-Process CMP
構成
構成なし
OEMモデルの説明
6DS-SP CMP system, a game-changer for high-volume production environments that crave efficiency and precision. Armed with two wafer carriers and dual tables, this system effortlessly accommodates wafer sizes ranging from 100mm to 200mm. A standout feature is its sophisticated motor current endpoint, providing real-time feedback for unprecedented accuracy and control. The innovative multi-zoned ViPRR carriers contribute to its superiority, enhancing wafer handling and boosting process consistency. Where this system truly shines is in its performance capabilities. For 200mm Oxide CMP, it boasts an impressive WIW Uniformity of less than 5% 1 sigma, and a minimal edge exclusion of just 3mm, ensuring a meticulous yield. The 6DS-SP is not merely limited to Oxide applications but extends its prowess to W, AITiC, SOI, and PolySi domains, offering unparalleled flexibility. Equip your production line with the 6DS-SP CMP system, where advanced technology meets unmatched versatility.
ドキュメント

ドキュメントなし

同様のリスト
すべて表示