With an enlarged soldering chamber of up to 1,500 mm, a significantly higher throughput is possible. Alternatively, assemblies with a maximum length of up to 1,500 mm can also be soldered.

The goal is to develop and produce advanced and innovative vapor phase reflow soldering systems and to offer our customers a simple and high quality soldering process in the process. Vapor as an energy transfer medium is one of the most effective methods for heating assemblies. The efficiency is many times higher than, for example, heating by convection. 

VP2000-310

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