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LAM RESEARCH / SEZ DV-PRIME
    説明
    説明なし
    構成
    構成なし
    OEMモデルの説明
    The Da Vinci Prime (DVP) is an advanced single-wafer wet processing platform that combines SEZ’s proven Da Vinci technology with its newest capabilities. It is designed to address the increasing overlap of BEOL and FEOL applications and the emergence of new materials. The DVP features double-sided processing, non-damage defect removal, minimized watermark formation, and multi-chemical recirculation capabilities. It targets a mix of BEOL and FEOL applications and offers key benefits such as maximized throughput, enhanced surface defect removal, and reduced media consumption.
    ドキュメント

    ドキュメントなし

    LAM RESEARCH / SEZ

    DV-PRIME

    verified-listing-icon

    検証済み

    カテゴリ

    Wet Etch
    最終検証: 60日以上前
    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    不明


    製品ID:

    16689


    ウェーハサイズ:

    不明


    ヴィンテージ:

    2007

    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    同様のリスト
    すべて表示
    LAM RESEARCH / SEZ DV-PRIME
    LAM RESEARCH / SEZDV-PRIMEWet Etch
    ヴィンテージ: 2007状態: 中古
    最終確認5日前

    LAM RESEARCH / SEZ

    DV-PRIME

    verified-listing-icon

    検証済み

    カテゴリ

    Wet Etch
    最終検証: 60日以上前
    listing-photo-G2gvVlkJwBmYS7ACY04yS-A__iuXpE3GMK2f3zuR_Ao-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    不明


    製品ID:

    16689


    ウェーハサイズ:

    不明


    ヴィンテージ:

    2007


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    説明
    説明なし
    構成
    構成なし
    OEMモデルの説明
    The Da Vinci Prime (DVP) is an advanced single-wafer wet processing platform that combines SEZ’s proven Da Vinci technology with its newest capabilities. It is designed to address the increasing overlap of BEOL and FEOL applications and the emergence of new materials. The DVP features double-sided processing, non-damage defect removal, minimized watermark formation, and multi-chemical recirculation capabilities. It targets a mix of BEOL and FEOL applications and offers key benefits such as maximized throughput, enhanced surface defect removal, and reduced media consumption.
    ドキュメント

    ドキュメントなし

    同様のリスト
    すべて表示
    LAM RESEARCH / SEZ DV-PRIME
    LAM RESEARCH / SEZ
    DV-PRIME
    Wet Etchヴィンテージ: 2007状態: 中古最終検証: 5日前