TEL / TOKYO ELECTRON

CELLESTA +

CELLESTA™ -i for 300mm wafer surface clean processing system provides enhanced productivity and significantly decreased footprint. The system incorporates up to twenty units of cleaning chambers and has much smaller footprint. Furthermore, it is equipped with integrated chemical recycle technology contributing less CoO, physical cleaning function for the particle removal on wafers; all of these functions contribute to achieve higher productivity. Additionally, this platform has excellent system extendibility, which is able to equip advanced bevel clean unit dedicated to wafer periphery and backside clean unit with less chemical consumption.

300mm wafer cleaning system, wet etch, uses hot IPA dry, can hold up to 20 cleaning chambers, 1000 wph throughput, can have bevel clean unit.

CELLESTA-i	

The CELLESTA™ -i MD is a TEL's most advanced 300mm single wafer clean system for 10nm technology node and beyond. The system has state-of-the-art cleaning capability which enables damage less clean of the well-patterned wafer surface and damage free particle removal. Pattern collapse free drying technology is also realized by implements of both chamber atmosphere control and performance improvement of IPA dispenser. The system has achieved higher productivity and lower running cost with the use of newly developed chemical recycle concept. The CELLESTA™- i MD offers scalability and will strongly support the establishment of the most challenging wafer surface clean process technologies using various chemicals for Cu and other metal exposed layer of next generation devices.\

300mm wafer cleaning system, wet etch, uses IPA dry with new method, can hold up to 20 cleaning chambers, 1000 wph throughput.

TEL / TOKYO ELECTRON

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トップTEL / TOKYO ELECTRON Wet Etch

CELLESTA +

CELLESTA-i

CELLESTA-i MD

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すべてのTEL / TOKYO ELECTRON Wet Etch