Designed, developed & manufactured high performance and precision chemical processing equipment. Products included electrochemical deposition systems for electroplating copper, gold, solder and other metals; surface preparation systems for cleaning, stripping and etching silicon wafers; and wafer transport container cleaning systems.

Equinox is a single wafer, multi-chamber process platform for cassette-to-cassette cleaning, etching, developing, and electroplating. It offers configurations from one to six chambers with a centralized controller and robotics. The platform is capable of performing various processes on substrates ranging from 3" to 200mm in size. It works by using a central dual end-effector robot to transfer substrates from cassette to chamber and back again. Equinox can help automate manual steps and transfers while increasing throughput with a small footprint. It offers ultra-clean dry-to-dry operation with uniform plating and etching results. The platform can integrate sequential process steps with a low cost of ownership (CoO) and provides a migration path from small R&D platforms to production systems with the same process chambers and control features.

SEMITOOL

EQUINOX

The Storm Series offers advanced centrifugal spray cleaning solutions, ideal for carriers, boxes, and specifically the 300mm Front Opening Unified Pods (FOUPs) and Front Opening Shipping Boxes (FOSBs). Comprising the high-capacity Storm II and the economical Storm III, these cleaners are adept at handling cassette or carrier sizes up to 200mm. Notably, the Storm300 efficiently cleans and dries eight 300mm FOUPs and their doors in under 30 minutes, and can process up to 30 cassettes or FOUPs/FOSBs within an hour. Some of its standout advantages include its cost-effectiveness, making it the world's most economical cassette/box washer, and its high productivity. The Storm's notable features include its ability to rotate products through a DI water spray with an optional surfactant, ensuring thorough cleaning; a centrifugal acceleration drying system complemented by ULPA filtered and heated air; and a user-friendly dual color touch screen interface. Made from electropolished stainless steel, the Storm also boasts an anti-static system, a brushless DC motor drive, and the option for through-the-wall installation, ensuring both efficiency and durability.

STORM III

The Spray Solvent Tool (SST) is a world standard in chemical stripping, developing, and cleaning technology. It has a multichamber capability and is 300mm ready. The SST can be used for a variety of processes, including developing, photoresist stripping, polymer removal, pre-metal deposition cleaning, and metal lift-off. This tool provides a versatile and efficient solution for a wide range of applications in the semiconductor industry.

The Spray Acid Tool (SAT) is a versatile tool that offers a range of cleaning, etching, and stripping capabilities. It features a multichamber design that allows for safe and economical operation in a completely closed environment. The SAT is 300mm ready, meaning it can handle wafers of that size. Some of the specific applications of the SAT include post-CMP clean, photo-resist strip, polymer removal, pre-diffusion clean, monitor wafer clean, and metal etch. These processes are essential for the preparation and maintenance of semiconductor wafers during the manufacturing process.

The Spray Solvent Tool (SST) is a compact, efficient system that enhances chemical reactions on wafer surfaces. It employs mechanical and centrifugal forces to achieve uniform coverage on both sides of the wafer. The closed loop process control ensures consistent results, while continuous recycling and filtration of chemicals reduce waste. The SST offers precise temperature control and flexibility in chemical delivery methods. With its high throughput, small footprint, and operator safety features, it provides reliable and low-maintenance operation. The tool supports various processes, including GaAs clean, metal lift-off, photoresist removal, post-etch residue removal, and thin film heads. It utilizes technologies such as copper RDL and pillar structures. Flexibility - featuring two, four, or seven tank configuration in small footprint cabinet; process chambers, product carriers, and quick-disconnect rotors are available for wafers up to 200mm

SST 742

Introduced to the market during fiscal 2002, the Sirius was designed specifically to deliver HydrOzone process. HydrOzone, using a minimal amount of deionized water and ozone is a low cost process option in comparison to the typical processes used for photoresist stripping, photolithography rework and organic cleans. The Sirius is a manually loaded semi-automated system with a 50 wafer capacity spray processing chamber. The system is available to accommodate either 200mm or 300mm wafer sizes.


SIRIUS

Storm II is an auxiliary system that is the industry’s first batch centrifugal spray cleaning tool for boxes and cassettes. It is unsurpassed by competing technology in terms of cleanliness, ease of use, and economy. The tool can batch clean spray 300mm Capsil and Crystalpak, clean 200mm boxes and cassettes, 95mm three-piece shippers, and 65mm carriers and shippers. With its advanced technology, Storm II provides a reliable and efficient solution for cleaning various types of containers. 

STORM II

SSTF42120F	

SST 441

SST 221

SST 421

Magnum® is a multimodule chemical processing platform that combines solvent, acid, and spin rinser/dryer capabilities into a single automated system. It is designed for high throughput production and has the flexibility for future expansion. The platform is capable of handling 150mm, 200mm, and 300mm wafers. Magnum® is used for wet cleaning and etching processes, including Pre-W-Silicide (HF Vapor), Pre-Salicide Clean, Metal etch, Pre-CVD clean, Pre-diffusion clean, Photoresist strip, Polymer removal, CMP clean, and Reclaim.

MAGNUM

SST-C-421-280

SST 201

SST-C-221-280	

C221280PB

SST 641

SD250

SST 772

SST-C-621-280

SST 302

STORM 300

SST 300

SST 408

SST 642

SST-421-280F

During 2000 Semitool introduced Scepter line of spray solvent tools and rinser/dryers. The Scepter products have double the wafer capacity of our standard SST and rinser/dryers while using approximately the same amount of clean room space. This allows an existing fab the ability to increase throughput without adding space. The Scepter is designed for wafers up to 300mm in size.

Scepter SAT

SST-C-742-280

The Magnum 3000 designed for the new state-of-the-art 300mm wafer fabs currently planned by customers.


MAGNUM 3000

Millennium is a high-volume surface preparation system that incorporates spray, vapor, immersion, and rapid thermal anneal (RTA) technologies. It features high productive performance with six to ten processing chambers and one or two robots. The system utilizes Semitool’s Capsule™ technology for chemical delivery and surface tension gradient dry for advanced particle control. The chamber design can accommodate immersion, spray, vapor, or RTA processing. The system can increase productivity, reduce defect density, improve process control, reduce cycle time, and reduce cost of ownership. It has various applications including oxide etch, photoresist removal, post-CMP clean, pre-photo lithography clean, post-etch residue (polymer removal), back side metals clean, GaAs etch (gate recess etch), under bump metallurgy (UBM etch), pre-diffusion (pre-epi clean), pre-epi LTO oxide removal (bevels and face), pre-deposition (pre-gate clean), hydrOzone photoresist strip (post-ash), metal lift-off, Cu back side clean and bevel etch, back side films etch, fluorOzone clean, HF vapor etch.

MILLENNIUM

During 2000 Semitool introduced Scepter line of spray solvent tools and rinser/dryers. The Scepter products have double the wafer capacity of our standard SST and rinser/dryers while using approximately the same amount of clean room space. This allows an existing fab the ability to increase throughput without adding space. The Scepter is designed for wafers up to 300mm in size.


SEMITOOL

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すべてのSEMITOOL Wet processing