The Eagle 60 is a wire bonder from ASM that is capable of ultra-fine pitch bonding for advanced ball grid array (BGA) devices.

ASM is a supplier of semiconductor process equipment for wafer processing, including lithography, deposition, ion implant and single-wafer epitaxy. ASM is part of the ASM International NV group that also includes ASM Pacific Technology (ASMPT). ASMPT, in which ASMI holds a substantial ownership is a leading supplier of semiconductor process equipment for wafer assembly and packaging, and for surface mount technology.



EAGLE 60

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6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

EAGLE 60

カテゴリ

概要（Overview）

現在の掲載品

サービス

トップ掲載リスト

ASM

EAGLE 60

ASM

EAGLE 60

ASM

EAGLE 60

ASM

EAGLE 60

Moovに掲載品して、すぐに申し分ない購入者を見つけましょう。

ASM

EAGLE 60

ASM

EAGLE 60

ASM

EAGLE 60

ASM

EAGLE 60