概要（Overview）

Automatic Dual Head Wire Bonder. Bonds to almost any electronic package requiring 100-500 micron (4-20 mil) wire. Four-axis head allows bonding in any direction, to any type of module, leadframe or hybrid substrate. Programmable bonding parameters for each bond produce better bond quality and reliability. Programmable indexing and simplified tooling for fast, simple and repeatable production changeovers. Enhanced process control features can be individually modified for each bond. Orthodyne proprietary gray-scale pattern recognition system gives higher yield and throughput rates. Low maintenance bond head with no pivot bearing or solenoids to bind or wear. Enhanced diagnostics, statistics and wire handling features for better process control. Sophisticated, menu driven software is easy to program and modify. Options include non-destructive pull testing with exclusive built-in loop height detector, and destructive pull test mode.