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6" Fab For Sale from Moov - Click Here to Learn More
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SHINKAWA UTC 1000 SUPER
  • SHINKAWA UTC 1000 SUPER
  • SHINKAWA UTC 1000 SUPER
  • SHINKAWA UTC 1000 SUPER
説明
Wire Bonder
構成
構成なし
OEMモデルの説明
The UTC-1000 Super wire bonder is a high-speed wire bonder that is compatible with SiP including stacked CSP. It is designed for bonding CSP, BGA, Small Substrate, and Lead Frame Type ICs. The UTC-1000 Super wire bonder is equipped with Shinkawa RPS technology, which is the world’s first capillary tip position closed-loop control that solves fine-pitch bonding misalignment and supports 40μm pad-pitch bonding. The Shinkawa NRS technology reduces vibration that hinders fine-pitch bonding and ensures stable bondability. The UTC-1000 Super wire bonder has various loop modes that are ideal for bonding stacked dies as standard. It also has numerous automatic functions that reduce the burden on the operator
ドキュメント

ドキュメントなし

SHINKAWA

UTC 1000 SUPER

verified-listing-icon

検証済み

カテゴリ
Wire / Wedge / Ball Bonder

最終検証: 60日以上前

主なアイテムの詳細

状態:

Used


稼働ステータス:

不明


製品ID:

111755


ウェーハサイズ:

不明


ヴィンテージ:

2010


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示

SHINKAWA

UTC 1000 SUPER

verified-listing-icon
検証済み
カテゴリ
Wire / Wedge / Ball Bonder
最終検証: 60日以上前
listing-photo-c39863895d5241b6929e0ec74753a72c-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
主なアイテムの詳細

状態:

Used


稼働ステータス:

不明


製品ID:

111755


ウェーハサイズ:

不明


ヴィンテージ:

2010


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Wire Bonder
構成
構成なし
OEMモデルの説明
The UTC-1000 Super wire bonder is a high-speed wire bonder that is compatible with SiP including stacked CSP. It is designed for bonding CSP, BGA, Small Substrate, and Lead Frame Type ICs. The UTC-1000 Super wire bonder is equipped with Shinkawa RPS technology, which is the world’s first capillary tip position closed-loop control that solves fine-pitch bonding misalignment and supports 40μm pad-pitch bonding. The Shinkawa NRS technology reduces vibration that hinders fine-pitch bonding and ensures stable bondability. The UTC-1000 Super wire bonder has various loop modes that are ideal for bonding stacked dies as standard. It also has numerous automatic functions that reduce the burden on the operator
ドキュメント

ドキュメントなし

同様のリスト
すべて表示