概要（Overview）

An ultrasonic ball-wedge bonder for gold wire in the thin wire range and is designed for wire bonds from17 μm and 50 μm (0.7 mil to 2 mil) in thickness. The graphical user interface ensures easy, intuitive access to a multitude of machine and application parameters. The operations for program preparation are conducted interactively, which enables safe operation and higher productivity. Wire Bonder