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6" Fab For Sale from Moov - Click Here to Learn More
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SHINKAWA UTC 1000 SUPER
    説明
    説明なし
    構成
    構成なし
    OEMモデルの説明
    The UTC-1000 Super wire bonder is a high-speed wire bonder that is compatible with SiP including stacked CSP. It is designed for bonding CSP, BGA, Small Substrate, and Lead Frame Type ICs. The UTC-1000 Super wire bonder is equipped with Shinkawa RPS technology, which is the world’s first capillary tip position closed-loop control that solves fine-pitch bonding misalignment and supports 40μm pad-pitch bonding. The Shinkawa NRS technology reduces vibration that hinders fine-pitch bonding and ensures stable bondability. The UTC-1000 Super wire bonder has various loop modes that are ideal for bonding stacked dies as standard. It also has numerous automatic functions that reduce the burden on the operator
    ドキュメント

    ドキュメントなし

    SHINKAWA

    UTC 1000 SUPER

    verified-listing-icon

    検証済み

    カテゴリ
    Wire / Wedge / Ball Bonder

    最終検証: 60日以上前

    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    不明


    製品ID:

    86421


    ウェーハサイズ:

    8"/200mm


    ヴィンテージ:

    2006


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    同様のリスト
    すべて表示
    SHINKAWA UTC 1000 SUPER

    SHINKAWA

    UTC 1000 SUPER

    Wire / Wedge / Ball Bonder
    ヴィンテージ: 2006状態: 中古
    最終確認昨日

    SHINKAWA

    UTC 1000 SUPER

    verified-listing-icon
    検証済み
    カテゴリ
    Wire / Wedge / Ball Bonder
    最終検証: 60日以上前
    listing-photo-ef5b2b91f61c4955937731c43403c493-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    不明


    製品ID:

    86421


    ウェーハサイズ:

    8"/200mm


    ヴィンテージ:

    2006


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    説明
    説明なし
    構成
    構成なし
    OEMモデルの説明
    The UTC-1000 Super wire bonder is a high-speed wire bonder that is compatible with SiP including stacked CSP. It is designed for bonding CSP, BGA, Small Substrate, and Lead Frame Type ICs. The UTC-1000 Super wire bonder is equipped with Shinkawa RPS technology, which is the world’s first capillary tip position closed-loop control that solves fine-pitch bonding misalignment and supports 40μm pad-pitch bonding. The Shinkawa NRS technology reduces vibration that hinders fine-pitch bonding and ensures stable bondability. The UTC-1000 Super wire bonder has various loop modes that are ideal for bonding stacked dies as standard. It also has numerous automatic functions that reduce the burden on the operator
    ドキュメント

    ドキュメントなし

    同様のリスト
    すべて表示
    SHINKAWA UTC 1000 SUPER

    SHINKAWA

    UTC 1000 SUPER

    Wire / Wedge / Ball Bonderヴィンテージ: 2006状態: 中古最終検証:昨日
    SHINKAWA UTC 1000 SUPER

    SHINKAWA

    UTC 1000 SUPER

    Wire / Wedge / Ball Bonderヴィンテージ: 2005状態: 中古最終検証:昨日
    SHINKAWA UTC 1000 SUPER

    SHINKAWA

    UTC 1000 SUPER

    Wire / Wedge / Ball Bonderヴィンテージ: 2006状態: 中古最終検証:昨日