説明
ASM International Eagle XP EmerALD ALD (Atomic Layer Deposition)構成
Configuration : Tool Model : XP Platform System SW(OS) version is Ver 1. 58a1-001 All cables are present Robot Type is Yawuski Power Supply & AC Dist Box : P/N 1060-625-01 Backing Pump(s) : ALD/LL/WHC is EDWARDS-IXH1210 Heater Jacket : INTRACO TAIWAN CORPORATION Facility Requirements : CDA LLC PN2 : 403 DIW : 2.95 Vacuum Load Port vacuum : -86.2 Gas LLC Pressure : 0.56/0.209 MPA FI : 100 Pa Ar : 500 SCCM N2 : 500 SCCM Ar : 3 SLM Differential : 3.5 PaOEMモデルの説明
The ASM EAGLE XP is an advanced wire bonder machine manufactured by ASM Assembly Systems, a division of ASM Pacific Technology. Wire bonding is a key process in semiconductor packaging that involves connecting integrated circuits (ICs) or other semiconductor devices to the package leads or interconnects using fine wires.ドキュメント
ドキュメントなし
ASM
EAGLE XP
検証済み
カテゴリ
ALD
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
53755
ウェーハサイズ：
12"/300mm
ヴィンテージ：
2012
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ASM
EAGLE XP
検証済み
カテゴリ
ALD
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
53755
ウェーハサイズ：
12"/300mm
ヴィンテージ：
2012
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
ASM International Eagle XP EmerALD ALD (Atomic Layer Deposition)構成
Configuration : Tool Model : XP Platform System SW(OS) version is Ver 1. 58a1-001 All cables are present Robot Type is Yawuski Power Supply & AC Dist Box : P/N 1060-625-01 Backing Pump(s) : ALD/LL/WHC is EDWARDS-IXH1210 Heater Jacket : INTRACO TAIWAN CORPORATION Facility Requirements : CDA LLC PN2 : 403 DIW : 2.95 Vacuum Load Port vacuum : -86.2 Gas LLC Pressure : 0.56/0.209 MPA FI : 100 Pa Ar : 500 SCCM N2 : 500 SCCM Ar : 3 SLM Differential : 3.5 PaOEMモデルの説明
The ASM EAGLE XP is an advanced wire bonder machine manufactured by ASM Assembly Systems, a division of ASM Pacific Technology. Wire bonding is a key process in semiconductor packaging that involves connecting integrated circuits (ICs) or other semiconductor devices to the package leads or interconnects using fine wires.ドキュメント
ドキュメントなし