説明
The system is new, still in the OEM crates. It is configured with two chambers, could be set up as one chamber. Either chamber would run plasma or thermal process. The system is for 200mm wafers with a Hine autoloader, but could handle a manual batch process.構成
BENEQ TFS 200 Dual Chamber System Configured: Precursors plumbed for 2 thermal, 4 liquid TFS 200-338 Tool chamber and cables TFS 200-339 Tool chamber and cables +A2 Electrical cabinet for TFS200-338 +A2 Electrical cabinet for TFS200-339 Hine HA200 autoloader with load lock and aligner Liquid source bubbler single line 200ml Rack cabinet RF Generator Beckhoff panel pole PC Plasma head Holder lifter Substrate lifter Plastic hatch Reaction chamber ALU HS300 Tank Liquid source bubbler single line 200ml Liquid source bubbler double line 200ml Liquid source bottle for H2O Documents Panel pole PC stand Chiller TransformerOEMモデルの説明
Beneq TFS 200 is the most flexible ALD research platform ever designed for academic research and corporate R&D. Beneq TFS 200 has specifically been designed to minimize any cross contamination that could happen in a multi-user research environment. The large number of available options and upgrades means that your Beneq TFS 200 will grow with you to meet even the most demanding research requirements. Beneq TFS 200 represents technical solutions that enable deposition of superior quality coatings on wafers, planar objects, porous bulk materials and complex 3D objects with very high aspect ratio (HAR) features. Direct and remote plasma-enhanced deposition (PEALD) is available in Beneq TFS 200 as a standard option. The plasma is capacitively-coupled (CCP), which is the industry standard today. The CCP plasma option offers both direct and remote plasma-enhanced ALD (PEALD) for substrates up to 200mm, face-up or face-down.ドキュメント
ドキュメントなし
BENEQ
TFS 200
検証済み
カテゴリ
ALD
最終検証： 10日前
主なアイテムの詳細
状態：
New
稼働ステータス:
Deinstalled / Crated
製品ID：
97721
ウェーハサイズ：
8"/200mm
ヴィンテージ：
2023
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
BENEQ
TFS 200
カテゴリ
ALD
最終検証： 10日前
主なアイテムの詳細
状態：
New
稼働ステータス:
Deinstalled / Crated
製品ID：
97721
ウェーハサイズ：
8"/200mm
ヴィンテージ：
2023
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
The system is new, still in the OEM crates. It is configured with two chambers, could be set up as one chamber. Either chamber would run plasma or thermal process. The system is for 200mm wafers with a Hine autoloader, but could handle a manual batch process.構成
BENEQ TFS 200 Dual Chamber System Configured: Precursors plumbed for 2 thermal, 4 liquid TFS 200-338 Tool chamber and cables TFS 200-339 Tool chamber and cables +A2 Electrical cabinet for TFS200-338 +A2 Electrical cabinet for TFS200-339 Hine HA200 autoloader with load lock and aligner Liquid source bubbler single line 200ml Rack cabinet RF Generator Beckhoff panel pole PC Plasma head Holder lifter Substrate lifter Plastic hatch Reaction chamber ALU HS300 Tank Liquid source bubbler single line 200ml Liquid source bubbler double line 200ml Liquid source bottle for H2O Documents Panel pole PC stand Chiller TransformerOEMモデルの説明
Beneq TFS 200 is the most flexible ALD research platform ever designed for academic research and corporate R&D. Beneq TFS 200 has specifically been designed to minimize any cross contamination that could happen in a multi-user research environment. The large number of available options and upgrades means that your Beneq TFS 200 will grow with you to meet even the most demanding research requirements. Beneq TFS 200 represents technical solutions that enable deposition of superior quality coatings on wafers, planar objects, porous bulk materials and complex 3D objects with very high aspect ratio (HAR) features. Direct and remote plasma-enhanced deposition (PEALD) is available in Beneq TFS 200 as a standard option. The plasma is capacitively-coupled (CCP), which is the industry standard today. The CCP plasma option offers both direct and remote plasma-enhanced ALD (PEALD) for substrates up to 200mm, face-up or face-down.ドキュメント
ドキュメントなし